Modeling of Radiation-Induced Defect Recovery in 3C-SiC Under High Field Bias Conditions

In this work, the implications of high field bias conditions in radiation-induced defect recovery in 3C-SiC crystals is studied. It is well known that transient heating effects (or thermal spikes) occur when energetic swift heavy ions (SHIs) deposit energy to the surrounding medium via ionization. Here, we explore the dynamics of this transient event under high background electric fields in 3C-SiC, which is what occurs when an ion strike coincides with field-sensitive volumes. In this study, we use the Ensemble Monte Carlo method to quantify how the energy deposition of the ionized regions change in response to high background electric fields. Subsequently, we study the relationship between the radiation-induced thermal spike and defect recovery using molecular dynamics simulations. We find that field strengths below the critical breakdown of wide bandgap devices are sufficient to exacerbate the localized heating, which subsequently enhances the defect recovery effect. This work is beneficial for 3C-SiC electronics and materials used in high radiation environments.Comment: 6 figures, 20 page

High-temperature Ultraviolet Photodetectors: A Review

Wide bandgap semiconductors have become the most attractive materials in optoelectronics in the last decade. Their wide bandgap and intrinsic properties have advanced the development of reliable photodetectors to selectively detect short wavelengths (i.e., ultraviolet, UV) in high temperature regions (up to 300{\deg}C). The main driver for the development of high-temperature UV detection instrumentation is in-situ monitoring of hostile environments and processes found within industrial, automotive, aerospace, and energy production systems that emit UV signatures. In this review, a summary of the optical performance (in terms of photocurrent-to-dark current ratio, responsivity, quantum efficiency, and response time) and uncooled, high-temperature characterization of III-nitride, SiC, and other wide bandgap semiconductor UV photodetectors is presented

Tuning Electrical and Thermal Transport in AlGaN/GaN Heterostructures via Buffer Layer Engineering

Over the last decade, progress in wide bandgap, III-V materials systems based on gallium nitride (GaN) has been a major driver in the realization of high power and high frequency electronic devices. Since the highly conductive, two-dimensional electron gas (2DEG) at the AlGaN/GaN interface is based on built-in polarization fields (not doping) and is confined to very small thicknesses, its charge carriers exhibit much higher mobilities in comparison to their doped counterparts. In this study, we show that this heterostructured material also offers the unique ability to manipulate electrical transport separately from thermal transport through the examination of fully-suspended AlGaN/GaN diaphragms of varied GaN buffer layer thicknesses. Notably, we show that ~$100$ nm thin GaN layers can considerably impede heat flow without electrical transport degradation, and that a significant improvement (~$4$x) in the thermoelectric figure of merit ($\it zT$) over externally doped GaN is observed in 2DEG based heterostructures. We also observe state-of-the art thermoelectric power factors ($4-7\times$ $10^{-3}$$\,Wm^{-1}K^{-2}$) at room temperature) in the 2DEG of this material system. This remarkable tuning behavior and thermoelectric enhancement, elucidated here for the first time in a polarization-based heterostructure, is achieved since the electrons are at the heterostructured interface, while the phonons are within the material system. These results highlight the potential for using the 2DEG in III-V materials for on-chip thermal sensing and energy harvesting.Comment: Accepted for publication in Advanced Functional Materials, in press (2018

High responsivity, low dark current ultraviolet photodetector based on AlGaN/GaN interdigitated transducer

An ultraviolet (UV) photodetector employing the two-dimensional electron gas (2DEG) formed at the AlGaN/GaN interface as an interdigitated transducer (IDT) is characterized under optical stimulus. The 2DEG-IDT photodetector exhibits a record high normalized photocurrent-to-dark current ratio (NPDR, $6\times10^{14}$). In addition, we observe a high responsivity ($7,800$ A/W) and ultraviolet-visible rejection-ratio ($10^{6}$), among the highest reported values for any GaN photodetector architecture. We propose a gain mechanism to explain the high responsivity of this device architecture, which corresponds to an internal gain of $26,000$. We argue that the valence band offset in the AlGaN/GaN heterostructure is essential in achieving this high responsivity, allowing for large gains without necessitating the presence of trap states, in contrast to common metal-semiconductor-metal (MSM) photodetector architectures. Our proposed gain mechanism is consistent with measurements of the scaling of gain with device channel width and incident power. In addition to high performance, this photodetector architecture has a simple two-step fabrication flow that is monolithically compatible with AlGaN/GaN high electron mobility transistor (HEMT) processing. This unique combination of low dark current, high responsivity and compatibility with HEMT processing is attractive for a variety of UV sensing applications

Molybdenum Trioxide Gates for Suppression of Leakage Current in InAlN/GaN HEMTs at 300{\deg}C

Because high electron mobility transistors (HEMTs) often exhibit significant gate leakage during high-temperature operation, the choice of Schottky metal is critical. Increased gate leakage and reduced ON/OFF ratio are unsuitable for the design of high-temperature electronics and integrated circuits. This paper presents high-temperature characteristics of depletion-mode molybdenum trioxide (MoO${_3}$)-gated InAlN/GaN-on-silicon HEMTs in air. After a room temperature oxidation of the Mo for 10 weeks, the leakage of the HEMT is reduced over 60 times compared to the as-deposited Mo. The use of MoO${_3}$ as the Schottky gate material enables low gate leakage, resulting in a high ON/OFF current ratio of 1.2 x 10${^8}$ at 25{\deg}C and 1.2 x 10${^5}$ at 300{\deg}C in air. At 400{\deg}C, gate control of the InAlN/GaN two-dimensional electron gas (2DEG) channel is lost and unrecoverable. Here, this permanent device failure is attributed to volatilization of the MoO${_3}$ gate due to the presence of water vapor in air. Passivation of the device with SiN enables operation up to 500{\deg}C, but also increases the leakage current. The suppression of gate leakage via Mo oxidation and resulting high ON/OFF ratio paves the way for viable high-temperature GaN-based electronics that can function beyond the thermal limit of silicon once proper passivation is achieved

Effect of Proton Irradiation Temperature on Zinc Oxide Metal-Semiconductor-Metal Ultraviolet Photodetectors

The electrical and structural characteristics of 50 nm zinc oxide (ZnO) metal-semiconductor-metal (MSM) ultraviolet (UV) photodetectors subjected to proton irradiation at different temperatures are reported and compared. We irradiated the devices with 200 keV protons to a fluence of 1016 cm-2. Examination of the X-ray diffraction (XRD) rocking curves indicates a strongly preferred (100) orientation for the grains of the as-deposited film, with decreases in crystal quality for all irradiated samples. In addition, peak shifts in XRD and Raman spectra of the control sample relative to well-known theoretical positions are indicative of tensile strain in the as-deposited ZnO films. We observed shifts of these peaks towards theoretical unstrained positions in the irradiated films relative to the as-deposited film indicate partial relaxation of this strain. Raman spectra also indicate increases of oxygen vacancies (V_O ) and zinc interstitials (Zn_i ) relative to the control sample. Additionally, photocurrent versus time measurements showed up to 2x increases in time constants for samples irradiated at lower temperatures months after irradiation, indicating that the defects introduced by suppression of thermally-activated dynamic annealing process has a long-term deleterious effect on device performance.Comment: 5 Pages, 4 figure

Micro-Tesla Offset in Thermally Stable AlGaN/GaN 2DEG Hall-effect Plates using Current Spinning

This letter describes the characterization of a low-offset Hall-effect plate using the AlGaN/GaN two-dimensional electron gas(2DEG). Four-phase current spinning was used to reduce sensor offset voltage to values in the range of 20 nV, which corresponds to a low residual offset of 2.6 micro-Tesla when supplied with low voltages (0.04 to 0.5V). These offsets are 50x smaller than the values previously reported for GaN Hall-effect plates, and it is on par with state-of-the-art silicon Hall-effect plates. In addition, the offset does not exceed 10 micro-Tesla even at higher supply voltage of 2.34V. The sensor also shows stable current-scaled sensitivity over a wide temperature range of -100C to 200C, with temperature drift of -125 ppm/C. This value is 3x better than state-of-the-art Silicon Hall-effect plates. Additionally, the sensor's voltage sensitivity (57 mV/V/T) is also similar. Because of their low offset values, AlGaN/GaN Hall-effect plates are viable candidates for low-field and high temperature magnetic sensing in monolithic GaN systems used in extreme temperature environments such as power inverter, down-well, combustion, and space applications

Analysis of the Mobility-Limiting Mechanisms of the Two-Dimensional Hole Gas on Hydrogen-Terminated Diamond

Here we present an analysis of the mobility-limiting mechanisms of a two-dimensional hole gas on hydrogen-terminated diamond surfaces. The scattering rates of surface impurities, surface roughness, non-polar optical phonons, and acoustic phonons are included. Using a Schrodinger/Poisson solver, the heavy hole, light hole, and split-off bands are treated separately. To compare the calculations with experimental data, Hall-effect structures were fabricated and measured at temperatures ranging from 25 to 700 K, with hole sheet densities ranging from 2 to 6$\times10^{12}\;\text{cm}^{-2}$ and typical mobilities measured from 60 to 100 cm$^{2}$/(V$\cdot$s) at room temperature. Existing data from literature was also used, which spans sheet densities above 1$\times10^{13}\;\text{cm}^{-2}$. Our analysis indicates that for low sheet densities, surface impurity scattering by charged acceptors and surface roughness are not sufficient to account for the low mobility. Moreover, the experimental data suggests that long-range potential fluctuations exist at the diamond surface, and are particularly enhanced at lower sheet densities. Thus, we propose a second type of surface impurity scattering which is caused by disorder related to the C-H dipoles.Comment: 11 pages, 7 figure

Effect of Geometry on Sensitivity and Offset of AlGaN/GaN and InAlN/GaN Hall-effect Sensors

The current- and voltage-scaled sensitivities and signal-to-noise ratios (SNR) (with respect to thermal noise) of various octagonal AlGaN/GaN and InAlN/GaN Hall-effect sensors were examined in this work. The effect of metal contact lengths on sensitivity and sensor offset was evaluated. Calculations that take into account the shape of the device show that devices with point-like contacts have the highest current-scaled sensitivity (68.9 V/A/T), while devices with contacts of equal length to their non-contact sides have the highest voltage-scaled sensitivity (86.9 mV/V/T). The sensitivities of the two other devices follow the predicted trends closely. All the devices have offsets less than 20 $\mu$T at low supply current operation (< 300 $\mu$A) and most remain below 35 $\mu$T at higher supply current (up to 1.2 mA). The consistent low offsets across the devices imply that the choice of Hall-effect sensor geometry should mainly depend on whether the device is current-biased or voltage-biased and the frequency at which it will operate. This work demonstrates that GaN Hall-effect sensor performance can be improved by adjusting the geometry of the Hall-effect plate specific to its function (e.g., power electronics, navigation, automotive applications)

Gallium Nitride Photodetector Measurements of UV Emission from a Gaseous CH4/O2 Hybrid Rocket Igniter Plume

Owing to its wide (3.4 eV) and direct-tunable band gap, gallium nitride (GaN) is an excellent material platform for UV photodetectors. GaN is also stable in radiation-rich and high-temperature environments, which makes photodetectors fabricated using this material useful for in-situ flame detection and combustion monitoring. In this paper, we use a GaN photodetector to measure ultraviolet (UV) emissions from a hybrid rocket motor igniter plume. The normalized photocurrent-to-dark current ratio (NPDR) is a performance metric which simultaneously captures the two desired characteristics of high responsivity and low dark current. The NPDR of our device is record-high with a value of 6 x 10$^{14}$ W$^{-1}$ and the UV-to-visible rejection ratio is 4 x 10$^6$. The photodetector shows operation at high temperatures (up to 250{\deg}C), with the NPDR still remaining above 10$^9$ W$^{-1}$ and the peak wavelength shifting from 362 nm to 375 nm. The photodetector was placed at three radial distances (3", 5.5", and 7") from the base of the igniter plume and the oxidizer-to-fuel ratio (O2/CH4) was varied. The data demonstrates a clear trend of increasing current (and thus intensity of plume emission) with increasing fuel concentration and decreasing separation between the photodetector and the plume. By treating the plume as a black body, and calculating a radiative configuration factor corresponding to the geometry of the plume and the detector, we calculated average plume temperatures at each of the three oxidizer-to-fuel ratios. The estimated plume temperatures were between 850 and 950 K for all three combustion conditions. The temperature is roughly invariant for a fixed fuel concentration for the three tested distances. These data demonstrate the functionality of GaN as a material platform for use in harsh environment flame monitoring.Comment: Accepted to IEEE Aerospace Conference 201